There are many opportunities for individuals and companies to get involved with the OCP community.
CONTRIBUTE TO THE COMMUNITY
Join a current project, read the specs, offer comments and suggestions on the specs, help shape the direction of a spec as it is developing.
Feed ideas for new projects to the incubation committee.
Test out a prototype design.
Contribute a hardware or software prototype to a project.
To become a corporate member of the Open Compute Project Foundation and participate in the projects, please complete the OCP Membership Agreement. The individual membership agreement can be signed by creating an account/profile on the website. Once you've done that, please pick the projects you are interested in and sign the OWF CLA. (Please note the CLA only needs to be signed if you are contributing Intellectual Property). Now you're ready to engage with a current project or suggest a new one to the incubation committee.
- Corporate: Community, Silver, Gold, Platinum
The following is a list of all the areas where you can get involved and join the discussion:
The instructions for how to submit specs/designs to OCP can be found here.
Social Media Channels (Facebook, Twitter and Google+)
Online Meetings - TBA
OCP Summits: The Open Compute Project Foundation will host its large summits annually. Here are a few ways you can participate:
If your company is interested in sponsoring an OCP Summit, please contact email@example.com and we'd be happy to share upcoming opportunities.
Attend a summit! The next OCP Summit will be held in the SF Bay Area in January of 2014. Stay tuned for more information.
If you're interested in leading a technical workshop or presenting at a future summit, please contact firstname.lastname@example.org.
Engineering Workshops: The Open Compute Project Foundation hosts a series of engineering workshops each year to build the community. Registration for these is capped at 100 attendees, as they are working sessions. The goals of the engineering workshops are:
Increased community participation and stickiness.
Increase the OCP technology portfolio; depth and breadth of specifications and charters.
Drive the product-ionization of OCP’s specifications. A good example here is the Intel’s interconnect technology that enables Sipho.
Solidify specification versioning pipeline, release process, naming conventions.
Take into account/understand the suppliers needs and OCP partners needs; AMDs Roadrunner and the associated release and deployment is a good example here.
Implementation of OCP’s legal framework (CLA’s, OWFa’s).
Building out/addressing technologies for new sectors.
If you are interested in sponsoring an upcoming engineering workshop, please contact email@example.com.
- OCP Membership Agreement
- OCP Bylaws
- OCP IPR Policy
Recent Open Entries
- Bringing ONIE to the Server
- OCP European Summit Hackathon 2014
- Schedule, Speakers, and Sponsors - 2014 OCP European Summit
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