IEEE Santa Clara Valley CPMT Society Chapter

"New Drivers and Strategies for Multi-Die Packaging" -- Ivor Barber, Director, Package Design and Characterization, LSI Corporation

• Buffet dinner served at 6:00 PM ($20 if reserved by June 11) ; $10 for fulltime students and currently unemployed engineers; $5 more at the door; vegetarian available)

• Presentation (no cost) at 6:45 PM (arrive by 6:35 PM)

  Please register in advance for this event, using our IEEE Council's DoubleKnot registration site.

  You may register yourself, plus others from your company/institution, for both dinner and presentation, or for only the presentation. You may make an on-line payment for the dinner, or arrange to pay at the door.

PLEASE RESERVE IN ADVANCE --
• For dinner and/or meeting: at the Doubleknot link above.
• Even if you're coming only for the presentation, we want you to sign up on our registration web site, so we can quicken the sign-in process and get everyone seated by 6:45 PM.
Biltmore Hotel

• 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara, (408) 346-4620 -- click map at right.

  
  

  OVERVIEW:

      Several forces are driving a resurgence of interest in Multi-Die Packaging. While foundries hit increasing NRE, product cost and technical barriers, the Packaging Community has produced a plethora of Multi-Die solutions including Stacked Die, PoP (Package on Package),PIP (Package in Package), 2.5D, and 3D, and seen increasing use of MCM's (Multi Chip Modules) using prepackaged memory chips. More exotic solutions are emerging such as Embedded Die, Glass Interposers and Wafer Level Fan Out.
      While these solutions, or combinations of these solutions, offer significant advances in latency, bandwidth, power and form-factor, they face significant hurdles of supply chain and KGD (Known Good Die) issues and will ultimately be judged by the cold, unforgiving eye of the accountant.
      The presentation will consider these drivers and strategies from a High End Custom solution perspective.

  

  Speaker Biography:
  

      Ivor Barber graduated from Napier University in Edinburgh, Scotland in 1981 with a Bachelors degree in Technology. He has worked in Military & Aerospace and high-end package assembly at National Semiconductor, Fairchild Semiconductor and VLSI Technology.
      Ivor has spent the last 22 years at LSI Corporation in Milpitas in various engineering and management positions in Assembly, Package Characterization and Package Design. Ivor is currently Director of Package Design and Characterization at LSI Corporation. Ivor holds 12 US patents related to package design.

  
  

  ---

  If you are not on our Chapter's regular email distribution list for meeting anouncements, you can easily be added! Place yourself on our email distribution list [or send a request to Paul Wesling.]

  
  

  ---

  SCV Chapter Home Page	How to Join IEEE	Contact our Chapter Chair
  CPMT Society Home Page	IEEE Home Page	Email to Webmaster

  Last updated on

  SEARCH:

  Related searches:
  package chapter dinner design packaging

  gipoco.com is neither affiliated with the authors of this page or responsible
  for its contents. This is a safe-cache copy of the original web site.

  gipoco.com is neither affiliated with the authors of this page nor responsible for its contents. This is a safe-cache copy of the original web site.