Master Bond Whitepaper Library
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Thermally Conductive Adhesives Keep Things Cool
Through heat dissipation, thermally conductive adhesives and potting compounds play a pivotal role in the protection of today’s electronic circuitry. In tandem with the great growth of the technological sector comes the need for a new generation of innovative, highly advanced solutions capable of reliable performance in the ever increasing temperatures of electronic devices. Master Bond’s white paper examines the challenges design engineers face as chip makers up the ante on microprocessor power and density, and how thermally conductive adhesives and potting compounds can manage heat while solving other application issues. |
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How to Simplify Potting
Potting compounds play a vital role in the assembly and long term protection of delicate electronic components. The design tips in this paper will help you avoid the more common dilemmas associated with the selection and application of epoxy potting compounds. |
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Toughened
With adhesive products, high performance and rigidity are often thought to go hand in hand. And it is true that the very best strength, thermal, chemical and electrical properties tend to be found in rigid compounds, especially epoxies. Yet there is a growing class of adhesives, sealants and coatings that add ductility to the long list of desirable epoxy properties. Master Bond’s whitepaper examines the use of these toughened epoxies. |
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Low Stress Adhesives
Many of today’s intricate electronic assemblies are highly sensitive to the effects of temperature excursions, shock and vibration. An effective design strategy for managing thermal stress is to use stress absorbing materials to bond and encapsulate components. Design engineers can learn more about finding ways to minimize or relieve stress in this white paper. |
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Bonding Polyolefins
Advances in adhesive chemistry have made it possible to bond polyolefins effectively without the need for surface treatments. Learn more about Master Bond’s polyolefin-friendly adhesives that offer exceptional bond strength as well as best practices for selecting adhesives for polyolefin bonding. |
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UV Curing Adhesives Shine
UV curable adhesives are among the most user friendly adhesive products on the market today – if you know how to apply them. This white paper takes a closer look at the capabilities of UV curable formulations, the requirements for an optimal cure and the best applications for these versatile 100% reactive adhesives. |
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Understanding Low Outgassing Adhesives
Engineers often want to know whether an adhesive is low outgassing or generic. And while there are cases when nothing but a low outgassing product will do, the truth is that many so-called generic adhesives inherently have low outgassing levels. Here's a guide to understanding when low outgassing adhesives are the right choice. |
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When to Use a Fast Cure Adhesive
Fast cure adhesives are a great way to reduce assembly costs, but engineers would be wise to question the need for speed when selecting adhesives. This white paper provides an overview of the different types of fast cure adhesives, the strengths and weaknesses of each type of formulation, as well as factors to keep in mind when optimizing speed in the assembly process. |
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Advanced High Performance Epoxy Adhesives Revolutionize Structural Bonding
Explore the different joint designs, surface preparations, polymer types and performance properties to consider when using structural polymer adhesives to join different parts together. |
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Find The Right Medical Adhesive
Five basic questions will help engineers make a more educated choice when looking for the ideal medical adhesive for their application. Each question is a step toward choosing materials and adhesives that not only work together as a system, but also meet conflicting end-use and manufacturability requirements within a strict regulatory environment. |
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Making The Right Connections
As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. |
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