ARM, Inc.

EECatalog Tech Videos

Site Sponsors

Featured White Papers

• Analog Signal Conditioning for Accurate Measurements

  Q: Should I put some sort of circuit between my sensor and an analog-to-digital converter?
  A: Yes. You probably need some signal conditioning. The explanation below goes on for a bit, but stay with it and you'll understand what you need and why you need it.

• USB 3.1: Evolution and Revolution

  USB-IF Worldwide Developers Days introduced developers to the new USB 3.1 specification. This white paper digs deep into 10G USB 3.1 to clarify the evolutionary and revolutionary changes in the specification.

• 7 Key Considerations For Effective Chip-Package Thermal Co-Design

  Chip-package co-design is important for several reasons. Designing a large high power die, e.g. a System-on-Chip (SoC) without considering how to get the heat out is likely to lead

• Ultra Low-Power 9D Sensor Fusion Implementation: A Case Study

  Today, the ability to track the orientation or position of a device is a common feature in many portable and wearable products. Computing the orientation is a non-trivial task that converts inputs from multiple motion sensors into accurate position information. This computation is called sensor fusion and it eliminates inaccuracies from noisy sensor inputs. This paper shows how using DesignWare® ARC® Processor EXtension (APEX) technology improves cycle count and energy consumption for a power-efficient implementation of a 9D fusion algorithm on an IP subsystem.

• 10 Tips for Streamlining PCB Thermal Design… A High-Level ‘How To’ Guide

  Many aspects of a PCB’s performance are determined during detailed design. Thermal issues with the PCB design are largely ‘locked in’ during the component (i.e. chip package)

• 10 Tips for Predicting Component Temperatures… A High-Level ‘How To’ Guide

  Recently, physics-based reliability prediction has related electronic assembly failure rates to the rate and magnitude of temperature change over an operational cycle, both of which are influenced by steady-state operating temperature. Whether the intention is to increase reliability, or improve performance, accurate prediction of component temperatures helps meet design goals.

• 12 Key Considerations in Enclosure Thermal Design… A High-Level ‘How To’ Guide

  A natural focus when designing electronics products are, well the electronics. The electronics itself however, needs to work within some kind of enclosure, and must be designed with the enclosure in mind. Cooling is a system issue, which is why we advocate a top-down approach, starting at the enclosure level.

Upcoming Events

EECatalog Tech Videos

• ARM TechCon Videos: Interview with Ian Drew. (Part 2: 'mbedding' the IoT)

  Embedded editor Chris A. Ciufo chats with Ian Drew, CMO, ARM. In part 2, the guys discuss: ARM's mbed/mbed OS and Cortex-M7; the easy path to the IoT is made easy by ARM's new mbed

• ARM TechCon Videos: Interview with Ian Drew. (Part 1: Servers)

  Embedded editor Chris Ciufo chats with Ian Drew, CMO, ARM. ARM's move into 64-bit servers with HP's recent “Moonshot” announcement; how the IoT grows from the enterprise and handsets; and ARM partners' complete infrastructure for servers.

• Why Don't Software Programmers like Comments?

  Cristian Amitroaie, CEO of Amiq, talks with John Blyler about Specador, a automated HTML documentation tool for chip design and verification engineers. This tool generates meaningful documentation even from poorly documented source code, as it actually compiles the code and can generate cross-link class inheritance trees, design hierarchies, and diagrams. The need for this functionality lead to an interesting discussion about the software programming process and why programmers rarely document their own work.

• Why IP Providers Need the New 1149.1/JTAG

  Intellitech's CEO CJ Clark explains why the latest JTAG update brings much needed capabilities to IP providers and IC developers alike.

• Imec’s mm Wave Motion Sensing Technology

  Motion sensing applications with mm wave technology at Imec is the topic of this interview between Liesbet Van der Perre, Imec Program Director of Wireless Communication, and John Blyler, VP and CCO at Extension Media.

• Mentor’s Wally Rhines – Learning Curve; Golden 28nm, IoT Innovation and Systems Engineering

  Wally Rhines, Chairman and CEO of Mentor Graphics, talks about Moore's Law in light of the Learning Curve; 28nm as the golden node; critical need for IoT innovations; and why systems engineering often fails.

• Collaboration is the key to chip innovation

  In our third interview at the Design Automation Conference in Austin, Texas, John Blyler of Chip Design Magazine talks with Dennis Bibeau of Infotech about the importance of collaboration across all disciplines in achieving innovative chip design.