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Posted: July 14, 2014
Using Heavy Copper and EXTREME Copper in PCB Design and Fabrication for Maximum Reliability
An increasing number of power electronics products are taking advantage of a growing trend in the printed circuit board industry: Heavy Copper and EXTREME Copper Printed Circuit Boards.
Most commercially available PCBs are manufactured for low-voltage/low power applications, with copper traces/planes made up of copper weights ranging from 1/2 oz/ft2 to 3 oz/ft2. A heavy copper circuit is manufactured with copper weights anywhere between 4 oz/ft2 to 20 oz/ft2. Copper weights above 20 oz/ft2 and up to 200 oz/ft2 are also possible and are referred to as EXTREME Copper. Our discussion will focus primarily on Heavy Copper.
Epec Engineered Technologies
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Posted: July 14, 2014
A Novel High Thermal Conductive Underfill For Flip Chip Application
Silicon dioxide is normally used as filler in underfill. The thermal conductivity of underfill is less than 1 w/mk, which is not able to meet the current flip chip application requirements such as 3D stacked multi-chips packaging. No matter which direction the heat will be dissipated through PCB or chip, the heat has to pass through the underfill in 3D stacked chips. Therefore the increase of thermal conductivity of underfill can significantly enhance the reliability of electronic devices, particularly in 3D package devices. YINCAE Advanced Materials, LLC has developed a novel high thermal conductive underfill for flip chip applications. Diamond powder is selected as filler in our product system due to its excellent thermal stability and high thermal conductivity. Three different diamond powders have been used as filler in underfill, the thermal conductivity has been increased many times (up to 6w/mk), which can greatly reduce the thermal stress for solder joint. The flowability, pressure cooking test and other properties of underfill have been characterized and investigated. All details will be discussed in this paper.
YINCAE Advanced Materials, LLC
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Posted: July 14, 2014
Sealer Micro Switch likes it humid
When demanding environments and applications are involved, a properly sealed switch is the solution.
Wilbrecht LEDCO, Inc.
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Posted: April 22, 2014
Software Simplifies Testing to Military and Aerospace Standards
There are a wide variety of AC Sources on the market that provide variable voltage and frequency capabilities. Military and Aerospace standards, such as MIL-STD-704, DO-160 and ABD0100, and commercial standards such as IEC 61000-4, can require complex waveforms and test protocols that cannot be done with a simple AC Source with variable voltage and frequency. These standards can require an AC source with an arbitrary waveform or transient generator in order to create fast transients such as dips, drops and other profiles. While these profiles can be created on an AC source, it can be difficult and time consuming to replicate all of the required tests just from the front panel of an AC source.
Chroma Systems Solutions, Inc.
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Posted: February 20, 2014
Simultaneous Hipot Testing
It is desirable for component manufactures to perform hipot on multiple components at once. Many testers today come equipped with the ability to connect to a scanner/Matrix or may even have one built in. Although the tester has the ability to connect to multiple components, and allows for voltage to be applied to multiple components at once, the tester does not have the ability to determine which component has failed unless each component is tested individually. Testing individually in a sequence versus all at once can reduce throughput significantly. One manufacture wanted to know if their product fails, will the tester detect the failure if testing multiple components at once, or could the other parts “mask” the failed product. This application note investigates this inquiry.
Chroma Systems Solutions, Inc.
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Posted: February 20, 2014
Protection Circuits for DC Supply and DC Load in Battery Charge and Discharge Test
Green energy has drawn more and more attention in recent years. Countries all over the world have
also joined the research and production of energy storage type or power type batteries. In addition,
major car manufacturers have been putting in resources in research and develop electrical vehicles.
Therefore, Chroma has released related test solutions to meet the battery testing demands. Chroma’s
battery test solutions include battery test system 17000/17200 for battery cells and 17029 for battery
packs under 60V. For battery packs that are under 600V can be tested by using DC sources and DC loads
with soft panel as an option.
There are some safety precautions when doing battery charge and discharge test. Protection circuits are
required for DC source and DC load to prevent potential hazards and protect the source and load. This
application note is aimed to instruct the design of protection circuit for DC source and DC load.
Chroma Systems Solutions, Inc.
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Posted: February 7, 2014
Boundary Scan Integration on Flying Probe Testers
Boundary Scan Test integration into Flying Probe Testers has been a long sought after capability in the Electronics Industry. The most recent integration is the latest generation flying probe system that includes latest generation boundary scan hardware and software. The boundary scan hardware uses synchronously the TAP port and the flying probes to drive and sense signals on the board. The two technologies exchange information through shared DLL’s and software to ensure the test flow is optimized and the test coverage is maximized.
With the recent integration of the Boundary Scan technology into Flying Probe Testers, advantages to both technologies are evident. The EMS or OEM and the end user can benefit from the combined technologies: adding Boundary Scan to Flying probe can increase throughput by optimizing open/short and some component tests; adding Flying probe to Boundary Scan can increase overall test coverage by giving virtual node access to nets that are otherwise untestable to Boundary Scan. Viewed either way, the Cost of Test (COT) is reduced. Performing both tests synchronously makes the whole greater than the sum of the two techniques. From the boundary scan coverage standpoint the Flying Probe Tester can assist in providing virtual boundary scan cells where needed and accessing boundary scan enabled pins through non boundary scan devices such as buffers. From the Flying Probe test coverage standpoint Boundary Scan can provide shorts and open pin testing to the nets that otherwise may not be accessible by Flying Probe, e.g. Back to Back BGA and PoP pins. This paper provides technical insight to the Boundary Scan integration into Flying Probe Testers with the examples and illustrations of the benefits listed.
SPEA America
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Posted: February 7, 2014
USB Port Charging Pin ID Testing
The USB chargers on the market are diversified; however, the quality varies greatly that often causes usage problems, such as unable to charge the smart phone or tablet, damaging the battery or shortening the battery life due to unstable voltage/current, or even causing fire because of overheat during charge. Chroma ATE Inc. with more than two decades of testing experiences in power supply field has developed a variety of Switch Mode Power Supply Auto Test Systems. Their accuracy of the tests and powerful report generation and analysis functions are the indicators of the industry beyond competition.
Chroma Systems Solutions, Inc.
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Posted: February 7, 2014
Tri-Temperature Test for
Extreme temperature testing for IC’s was originally required for military grade applications only.
However, with increasing electronics devices being installed on vehicles and the popularity of mobile
devices, the potential of exposing these devices to very hot and cold temperatures are becoming
more common. Semiconductor IC Manufacturers now have to conduct functional tests under a wider
range of temperatures from hot to cold and ambient. This is known as the Tri-temp test requirement.
In some applications these temperatures can range from -55℃~+135℃.
Chroma Systems Solutions, Inc.
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Posted: January 17, 2014
Performance In. Water Out.
How to choose the right watertight switch for your application. How do watertight switches work, the various types and sizes, and IP watertight seal ratings.
Honeywell Sensing and Control
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