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Feb. 8, 2012 :: NEWS Cascade Microtech Reports Fourth Quarter 2011 Results

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Mar. 15, 2012 :: EVENT
JSAP Expo Spring 2012
Mar. 20, 2012 :: EVENT
SEMICON China

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Contact Probe Experts

Take advantage of our 25 years of extensive probing experience and knowledge. Contact our Probe Experts to design a probe to meet your measurement requirements. View more

Addressing the Challenges of Small Pad Probing

Smaller pads not only utilize less device real estate, they also allow sacrificial test structures to be placed in scribe lines, meaning process control monitoring and device characterization can be performed without using valuable space for sellable circuits. Probing pads with large dimensions is relatively simple with conventional probe technologies.

spacer A conventional probe mark compared to an InfinityQuad probe mark using a similar scale.
However, when trying to probe pad sizes of 50 um x 50 um or less, side skate becomes a challenge as it causes wider probe marks and can change the probe pitch with overtravel. Read how InfinityQuad solves this and other challenges of probing small pads.

Tech Brief: Addressing the Challenges of Small Pad Probing


LED Test- Challenges for Equipment Manufacturers

spacer As markets for display backlighting and solid-state lighting grow, equipment vendors adapt to meet the needs of a rapidly changing industry. New equipment must accommodate the range of test configurations found across the spectrum of manufacturers. At the same time, the equipment must keep the cost of test low to help reduce the overall cost of LEDs and contribute to the successful adoption of LED technology in consumer applications.

Cascade Microtech Partners With imec for 3D-TSV Probe Solutions

Cascade Microtech, Inc., a leading expert at enabling precision measurements of integrated circuits at the wafer level, and the nanoelectronics research center imec, today announced they have entered into a collaborative research partnership for testing and characterization of 3D integrated circuit (IC) test structures. Imec will work closely with Cascade Microtech to develop test methods and methodologies for emerging 3D Through-Silicon-Via (TSV) structures, and to lead the way in development of global standards for 3D IC development and production test. Read more ...

New Features Added to WinCalXE Calibration Software

WinCalXE 4.5 is a single software tool that contains the valuable features of both WinCalXE and SussCal®, and operates with all manual and semi-automatic Cascade Microtech and former SUSS MicroTec probe stations. WinCalXE 4.5 contains advanced calibration methods, including LRRM and a new LRM+ calibration algorithm.
Read more ... | Order free trial

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