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| Press Release |
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| QUALCOMM Introduces Industry’s First Single-Chip UMTS and HSDPA Solutions |
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Solutions Integrate Baseband, RF and Power Management Functions to Reduce Cost, Power Consumption and Size
SAN DIEGO —
November 13, 2006 —
QUALCOMM Incorporated (Nasdaq: QCOM), a leading developer and innovator of Code Division Multiple Access (CDMA) and other advanced wireless technologies, today announced an expansion to its QUALCOMM Single Chip™ (QSC™) family to include support for UMTS. The new QSC6240™ product for WEDGE (WCDMA and GSM/GPRS/EDGE) and QSC6270™ product for HEDGE (HSDPA/WCDMA and GSM/GPRS/EDGE) are the world's first solutions to integrate a monolithic die - with integrated radio transceiver, baseband modem and multimedia processor - together with power management functionality into a single chip for WCDMA (UMTS) and HSDPA handsets. The cost and time-to-market advantages of the single-chip solutions will help drive wireless broadband and 3G adoption in mass markets around the world.
“By introducing our fourth generation of single-chip solutions that include WCDMA/EDGE and HSDPA/EDGE, QUALCOMM is making the high-speed data and rich multimedia capabilities of 3G technologies accessible to a much wider base of wireless users around the world,” said Dr. Sanjay K. Jha, president of QUALCOMM CDMA Technologies. “QUALCOMM is leveraging its technology leadership in 3G and single-chip design to significantly drive down the cost of 3G handsets and considerably reduce time to market by offering the world's first single-chip WCDMA and HSDPA solutions.”
The high levels of integration in the QSC6240 and QSC6270 solutions significantly reduce bill-of-materials costs and discrete components, delivering board-area savings of up to 50 percent. The two solutions leverage cost-efficient 65nm CMOS process technology and significantly improve power efficiency for longer talk/standby times and an enhanced multimedia user experience. The two solutions feature:
- Complete chipset solution in a 12mm x 12mm package
- Up to 3 megapixel camera support
- Support for WCDMA (UMTS) in one of 800/850/900MHz, and two of 1700/1800/1900/2100 MHz bands, as well as quad-band GSM/GPRS/EDGE
- 72-voice simultaneous polyphonic ringtones
- Integrated USB 2.0 high speed
- Advanced codecs, including eAAC+, H.264, Real® and Windows Media®
- 15fps video encode and decode capability
- Support for OpenGL® ES 1.0 3D graphics capability
Sampling of the QSC6240 and QSC6270 solutions is scheduled for the third quarter of 2007.
For further information about QUALCOMM's QSC products, visit www.cdmatech.com/singlechip.
QUALCOMM Incorporated (www.qualcomm.com) is a leader in developing and delivering innovative digital wireless communications products and services based on CDMA and other advanced technologies. Headquartered in San Diego, Calif., QUALCOMM is included in the S&P 500 Index and is a 2006 FORTUNE 500® company traded on The Nasdaq Stock Market® under the ticker symbol QCOM.
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QUALCOMM is a registered trademark of QUALCOMM Incorporated. QUALCOMM Single Chip, QSC, QSC6240 and QSC6270 are trademarks of QUALCOMM Incorporated. OpenGL is a trademark or registered trademark of Silicon Graphics, Inc. in the United States and/or other countries worldwide. Real is a trademark or registered trademark of RealNetworks, Inc. Windows Media is a registered trademark or trademark of Microsoft Corporation in the United States and/or other countries. All other trademarks are the property of their respective owners.
QUALCOMM Contacts:
Kira Lee, QUALCOMM CDMA Technologies
Phone: 1-858-845-7571
Email: qctpublicrelations@qualcomm.com
Tina Asmar, Corporate Communications
Phone: 1-858-845-5959
Email: corpcomm@qualcomm.com
Garrett Ponder, Investor Relations
Phone: 1-858-658-4813
Email: ir@qualcomm.com
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