Fusible Alloys
Indalloy® Alloys - Liquid at Room Temperature
Several very low melting point Indalloy® alloys are liquid at room temperature. These alloys are finding increased uses in various applications formerly reserved for mercury metal. This is due to the fact that the metals in these alloys have lower toxicity than mercury, and, perhaps more significantly, that the vapor pressures of these alloys are substantially lower than mercury.
Alloy systems liquid at room temperature have a high degree of thermal conductivity far superior to ordinary non-metallic liquids. This results in the use of these materials for specific heat conducting applications, i.e. for heat dissipation of sensitive components during operation, machining and/or manufacturing.
Other advantages of these liquid alloy systems are their inherent high densities and electrical conductivities. Typical applications for these materials include thermostats, switches, barometers, heat transfer systems, and thermal cooling and heating designs.
The table below lists available Indalloy® alloys which are liquid at room temperature.
| Indalloy Number | Type | Liquidus C | Solidus C | Composition | Density lb/in3 |
Specific Gravity gm/cm3 |
|---|---|---|---|---|---|---|
| 46L | ordinary alloy | 7.6 | 6.5 | 61.0Ga / 25.0In / 13.0Sn / 1.0Zn | 0.2348 | 6.50 |
| 51 | eutectic alloy | 10.7 | 10.7 | 62.5Ga / 21.5In / 16.0Sn | 0.2348 | 6.50 |
| 60 | eutectic alloy | 15.7 | 15.7 | 75.5Ga / 24.5In | 0.2294 | 6.35 |
| 77 | ordinary alloy | 25.0 | 15.7 | 95Ga/5In | 0.2220 | 6.15 |
| 14 | pure metal | 29.78 | 29.78 | 100Ga | 0.2131 | 5.904 |
Packaging
Alloys are shipped in polyethylene bottles.
Storage/Shelf Life
Unopened bottles have a guaranteed one year shelf life. It is recommended that as alloy is removed from the bottle that the volume be replaced with dry argon. This will minimize any possibility of oxidation at the surface of the alloy. If the alloy has been stored below its melting point and has solidified, it should be remelted and thoroughly shaken or mixed before use.
Low Melting Point
Fusible alloys for demanding applications:
- Fuses
- Wax Pattern Dies
- Potting Molds
- Punch Anchoring
- Tube Bending
- Lens Blocking
| Properties | ||||||
|---|---|---|---|---|---|---|
| Property | Indalloy | |||||
| 117 | 158 | 160-190 | 217-440 | 255 | 281 | |
| Melting Point or Range Deg/F | 117 | 158 | 160-190 | 217-440 | 255 | 281 |
| Weight lbs/in3 | .32 | .339 | .341 | .343 | .380 | .315 |
| Tensile Strength lbs/in2 | 5,400 | 5,990 | 5,400 | 13,000 | 6,400 | 8,000 |
| Brinell Hardness No. | 12 | 9.2 | 9 | .19 | 10.2 | 22 |
| Maximum Load 30 sec lbs/in2 |
--- | 10,000 | 9,000 | 16,000 | 8,000 | 15,000 |
| Safe Load Sustained | --- | 300 | 300 | 300 | 300 | 500 |
| Conductivity (Electrical) Compared with Pure Copper | 3.34% | 4.17% | 4.27% | 2.57% | 1.75% | 5.00% |
| Cumulative Growth and Shrinkage Time after Casting | ||||||
| 2 min. | +.0005 | +.0025 | -.0004 | +.0008 | -.0008 | +.0007 |
| 6 min. | +.0002 | +.0027 | -.0007 | +.0014 | -.0011 | +.0007 |
| 30 min. | .0000 | +.0045 | -.0009 | +.0047 | -.0010 | +.0006 |
| 1 hr. | -.0001 | +.0051 | .0000 | +.0048 | -.0008 | +.0006 |
| 2 hr. | -.0002 | +.0051 | +.0016 | +.0048 | -.0004 | +.0006 |
| 5 hr. | -.0002 | +.0051 | +.0018 | +.0049 | .0000 | +.0005 |
| 500 hr. | -.0002 | +.0057 | +.0025 | +.0061 | +.0022 | +.0005 |
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